- Published: January 2024.
- Pages: 330
- Tables: 22
- Figures: 25
- Series: Electronics
The global landscape of semiconductor manufacturing is rapidly evolving, with advanced packaging emerging as a critical component of manufacturing and design. It affects power, performance, and cost on a macro level, and the basic functionality of all chips on a micro level. Advanced packaging allows for the creation of faster, cost-effective systems by integrating various chips, a technique that's increasingly essential given the physical limitations of traditional chip miniaturization. It is reshaping the industry, enabling the integration of diverse chip types and enhancing processing speeds.
The U.S. government recognizes the importance of advanced packaging and has introduced a $3 billion National Advanced Packaging Manufacturing Program aimed at establishing high-volume packaging facilities by the end of the decade. The focus on packaging complements the existing efforts under the CHIPS and Science Act, emphasizing the interconnectedness of chipmaking and packaging.
The Global Market for Advanced Semiconductor Packaging 2024-2035 provides a comprehensive analysis of the global advanced semiconductor packaging technologies market from 2020-2035. It encompasses packaging approaches like wafer-level packaging, 2.5D/3D integration, chiplets, fan-out, and flip chip, analyzing market values in the billions (USD) by type, region, and end-use application.
Trends analyzed include heterogeneous integration, interconnects, thermal solutions, miniaturization, supply chain maturity, simulation/data analytics. Leading companies profiled include TSMC, Samsung, Intel, JCET, Amkor. Applications covered include AI, mobile, automotive, aerospace, IoT, communications (5G/6G), high performance computing, medical, and consumer electronics.
Regional markets explored include North America, Asia Pacific, Europe, China, Japan, and RoW. The report also assesses drivers like ML/AI, data centers, EV/ADAS; challenges like costs, complexity, reliability; emerging approaches like system-in-package, monolithic 3D ICs, advanced substrates, novel materials. Overall an in-depth benchmark analysis of the opportunities within the advancing semiconductor packaging industry.
Report contents include:
- Market size and forecasts
- Key technology trends
- Growth drivers and challenges
- Competitive landscape analysis
- Future packaging trends outlook
- In-depth analysis of wafer level packaging (WLP)
- System-in-Package (SiP) and heterogeneous integration
- Monolithic 3D ICs overview
- Advanced semiconductor packaging applications across key markets: AI, mobile, automotive, aerospace, IoT, communications, HPC, medical, consumer electronics
- Regional market breakdown
- Assessment of key industry challenges: complexity, costs, supply chain maturity, standards
- Company profiles: Strategies and technologies of 90 key players. Companies profiled include 3DSEMI, Amkor, Chipbond, ChipMOS, Intel Corporation, Leader-Tech Semiconductor, Powertech, Samsung Electronics, Silicon Box, SJ Semiconductor Corp., SK hynix, SPIL, Tongfu, Taiwan Semiconductor Manufacturing Company (TSMC) and Yuehai Integrated.
1 RESEARCH METHODOLOGY 14
2 EXECUTIVE SUMMARY 15
- 2.1 Semiconductor Packaging Technology Overview 16
- 2.1.1 Conventional packaging approaches 19
- 2.1.2 Advanced packaging approaches 20
- 2.2 Semiconductor Supply Chain 22
- 2.3 Key Technology Trends in Advanced Packaging 22
- 2.4 Market Size and Growth Projections (Billions USD) 24
- 2.4.1 By packaging type 24
- 2.4.2 By market 26
- 2.4.3 By region 28
- 2.5 Market Growth Drivers 30
- 2.6 Competitive Landscape 32
- 2.7 Market Challenges 34
- 2.8 Recent market news and investments 36
- 2.9 Future outlook 38
- 2.9.1 Heterogeneous Integration 39
- 2.9.2 Chiplets and Die Disaggregation 41
- 2.9.3 Advanced Interconnects 43
- 2.9.4 Scaling and Miniaturization 45
- 2.9.5 Thermal Management 47
- 2.9.6 Materials Innovation 48
- 2.9.7 Supply Chain Developments 50
- 2.9.8 Role of Simulation and Data Analytics 52
3 SEMICONDUCTOR PACKAGING TECHNOLOGIES 58
- 3.1 Transistor Device Scaling 58
- 3.1.1 Overview 58
- 3.2 Wafer Level Packaging 61
- 3.3 Fan-Out Wafer Level Packaging 62
- 3.4 Chiplets 64
- 3.5 Interconnection in Semiconductor Packaging 67
- 3.5.1 Overview 67
- 3.5.2 Wire bonding 67
- 3.5.3 Flip-chip bonding 69
- 3.5.4 Through-silicon via (TSV) bonding 72
- 3.5.5 Hybrid bonding with chiplets 73
- 3.6 2.5D and 3D Packaging 75
- 3.6.1 2.5D packaging 75
- 3.6.1.1 Overview 76
- 3.6.1.1.1 2.5D vs. 3D Packaging 76
- 3.6.1.2 Benefits 77
- 3.6.1.3 Challenges 79
- 3.6.1.4 Trends 80
- 3.6.1.5 Market players 81
- 3.6.1.6 2.5D Organic-based packaging 83
- 3.6.1.7 2.5D glass-based packaging 84
- 3.6.1.1 Overview 76
- 3.6.2 3D packaging 88
- 3.6.2.1 Benefits 89
- 3.6.2.2 Challenges 92
- 3.6.2.3 Trends 94
- 3.6.2.4 Embedded Si bridges 96
- 3.6.2.5 Si interposer 97
- 3.6.2.6 3D Hybrid bonding 98
- 3.6.2.7 Market players 98
- 3.6.1 2.5D packaging 75
- 3.7 Flip Chip Packaging 102
- 3.8 Embedded Die Packaging 104
- 3.9 Trends in Advanced Packaging 106
- 3.10 Packaging Roadmap 108
4 WAFER-LEVEL PACKAGING 111
- 4.1 Introduction 111
- 4.2 Benefits 112
- 4.3 Types of Wafer Level Packaging 113
- 4.3.1 Wafer Level Chip Scale Packaging 114
- 4.3.1.1 Overview 114
- 4.3.1.2 Advantages 114
- 4.3.1.3 Applications 115
- 4.3.2 Fan-Out Wafer Level Packaging 117
- 4.3.2.1 Overview 117
- 4.3.2.2 Advantages 117
- 4.3.2.3 Applications 119
- 4.3.3 Wafer Level Fan-Out Packaging 120
- 4.3.3.1 Overview 120
- 4.3.3.2 Benefits 121
- 4.3.3.3 Applications 122
- 4.3.4 Other Types of WLP 123
- 4.3.1 Wafer Level Chip Scale Packaging 114
- 4.4 WLP Manufacturing Processes 124
- 4.4.1 Wafer Preparation 124
- 4.4.2 RDL Buildup 125
- 4.4.3 Bumping 126
- 4.4.4 Encapsulation 127
- 4.4.5 Integration 128
- 4.4.6 Test and Singulation 129
- 4.5 Wafer Level Packaging Trends 131
- 4.6 Applications of Wafer Level Packaging 133
- 4.6.1 Mobile and Consumer Electronics 133
- 4.6.2 Automotive Electronics 134
- 4.6.3 IoT and Industrial 135
- 4.6.4 High Performance Computing 136
- 4.6.5 Aerospace and Defense 137
- 4.7 Wafer Level Packaging Outlook 138
5 SYSTEM-IN-PACKAGE AND HETEROGENEOUS INTEGRATION 139
- 5.1 Introduction 139
- 5.2 Approaches for heterogenous integration 141
- 5.3 SiP Manufacturing Approaches 142
- 5.3.1 2.5D Integrated Interposers 143
- 5.3.2 Multi-Chip Modules 145
- 5.3.3 3D Stacked packages 146
- 5.3.4 Fan-Out Wafer Level Packaging 149
- 5.3.5 Flip Chip Package-on-Package 150
- 5.4 SiP Component Integration 152
- 5.5 Heterogeneous Integration Drivers 154
- 5.6 Trends Driving SiP Adoption 155
- 5.7 SiP Applications 156
- 5.8 SiP Industry Landscape 157
- 5.9 Outlook on Heterogeneous Integration 160
6 MONOLITHIC 3D IC 162
- 6.1 Overview 162
- 6.2 Benefits 164
- 6.3 Challenges 165
- 6.4 Future outlook 166
7 MARKETS AND APPLICATIONS 168
- 7.1 Market value chain 168
- 7.2 Packaging trends by market 169
- 7.3 Artificial Intelligence (AI) 170
- 7.3.1 Applications 171
- 7.3.2 Packaging 172
- 7.4 Mobile and Handheld Devices 172
- 7.4.1 Applications 173
- 7.4.2 Packaging 173
- 7.5 High Performance Computing 175
- 7.5.1 Applications 175
- 7.5.2 Packaging 176
- 7.6 Automotive Electronics 179
- 7.6.1 Applications 179
- 7.6.2 Packaging 179
- 7.7 Internet of Things (IoT) Devices 180
- 7.7.1 Applications 181
- 7.7.2 Packaging 181
- 7.8 5G & 6G Communications Infrastructure 182
- 7.8.1 Applications 182
- 7.8.2 Packaging 182
- 7.9 Aerospace and Defense Electronics 185
- 7.9.1 Applications 185
- 7.9.2 Packaging 187
- 7.10 Medical Electronics 188
- 7.10.1 Applications 188
- 7.10.2 Packaging 189
- 7.11 Consumer Electronics 189
- 7.11.1 Applications 189
- 7.11.2 Packaging 190
- 7.12 Global market (Units) 193
- 7.12.1 By market 193
- 7.12.2 Regional markets 196
- 7.12.2.1 Asia Pacific 197
- 7.12.2.1.1 China 198
- 7.12.2.1.2 Taiwan 199
- 7.12.2.1.3 Japan 200
- 7.12.2.1.4 South Korea 201
- 7.12.2.2 North America 202
- 7.12.2.2.1 United States 203
- 7.12.2.2.2 Canada 204
- 7.12.2.2.3 Mexico 205
- 7.12.2.3 Europe 206
- 7.12.2.3.1 Germany 208
- 7.12.2.3.2 France 209
- 7.12.2.3.3 United Kingdom 210
- 7.12.2.3.4 Nordic Countries 211
- 7.12.2.4 Rest of World 212
- 7.12.2.1 Asia Pacific 197
8 MARKET PLAYERS 215
- 8.1 Integrated Device Manufacturers 215
- 8.2 Outsourced Semiconductor Assembly and Test (OSAT) Companies 217
- 8.3 Foundries 218
- 8.3.1 Semiconductor foundries technology roadmaps 218
- 8.4 Electronics OEMs 220
- 8.5 Packaging Equipment and Materials Companies 222
9 MARKET CHALLENGES 225
- 9.1 Technical Complexity 225
- 9.2 Supply Chain Maturity 226
- 9.3 Cost 227
- 9.4 Standards 228
- 9.5 Reliability Assurance 229
10 COMPANY PROFILES 230 (90 company profiles)
11 REFERENCES 317
List of Tables
- Table 1. Key Technology Trends in Advanced Packaging. 23
- Table 2. Global advanced semiconductor packaging market 2020-2035 (billions USD), by type. 24
- Table 3. Global advanced semiconductor packaging market 2020-2035 (billions USD), by market. 26
- Table 4. Global advanced semiconductor packaging market 2020-2035 (billions USD), by region. 28
- Table 5. Market Growth Drivers for advanced semiconductor packaging. 30
- Table 6. Challenges Facing Advanced Packaging Adoption. 34
- Table 7. Recent advanced semiconductor packaging market news and investments. 36
- Table 8. Challenges in transistor scaling. 60
- Table 9. Specifications of interconnection methods. 67
- Table 10. 2.5D vs. 3D packaging. 76
- Table 11. 2.5D packaging challenges. 79
- Table 12. Market players in 2.5D packaging. 81
- Table 13. Advantages and disadvantages of 3D packaging. 88
- Table 14. Trends in Advanced Packaging. 106
- Table 15. Key trends shaping wafer level packaging. 131
- Table 16. Key factors driving adoption of heterogeneous integration through SiPs and multi-die packages. 154
- Table 17. Benefits of monolithic 3D ICs. 164
- Table 18. Challenges of monolithic 3D ICs. 165
- Table 19. Advanced semiconductor packaging market value chain. 168
- Table 20. Markets and applications for advanced semiconductor packaging. 170
- Table 21. Advanced semiconductor packaging (units), 2020-2025, by market. 193
- Table 22. Advanced semiconductor packaging (units), 2020-2025, by region. 195
List of Figures
- Figure 1. Timeline of different packaging technologies. 19
- Figure 2. Evolution roadmap for semiconductor packaging. 20
- Figure 3. Semiconductor Supply Chain. 22
- Figure 4. Global advanced semiconductor packaging market 2020-2035 (billions USD), by type. 25
- Figure 5. Global advanced semiconductor packaging market 2020-2035 (billions USD), by market. 26
- Figure 6. Global advanced semiconductor packaging market 2020-2035 (billions USD), by region. 28
- Figure 7. Advanced semiconductor packaging (units), 2020-2025, by market. 56
- Figure 8. Scaling technology roadmap. 59
- Figure 9. Wafer-level chip scale packaging (WLCSP) 61
- Figure 10. Embedded wafer-level ball grid array (eWLB). 62
- Figure 11. Fan-out wafer-level packaging (FOWLP). 63
- Figure 12. Chiplet design. 64
- Figure 13. 2D chip packaging. 75
- Figure 14. 2.5D-integrated packaging on a silicon interposer. 79
- Figure 15. RDL fabrication. 79
- Figure 16. Three-die, wire-bond semiconductor assembly. 90
- Figure 17. 3D integration roadmap. 95
- Figure 18. Projected timelines for packaging and interconnects. 109
- Figure 19. Typical WLCSP structure. 114
- Figure 20. Typical FOWLP structure, 117
- Figure 21. 2.5D chiplet integration. 143
- Figure 22. Advanced semiconductor packaging (units), 2020-2025, by market. 194
- Figure 23. Advanced semiconductor packaging (units), 2020-2025, by region. 196
- Figure 24. 2.5D Molded Interposer on Substrate (MIoS) package. 291
- Figure 25. 12-layer HBM3. 297
Payment methods: Visa, Mastercard, American Express, Paypal, Bank Transfer.
To purchase by invoice (bank transfer) contact info@futuremarketsinc.com or select Bank Transfer (Invoice) as a payment method at checkout.
