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The Global Market for Advanced Semiconductor Packaging 2024-2035

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By on ELECTRONICS, LATEST REPORTS, REPORTS

  • Published: January 2024.
  • Pages: 330
  • Tables: 22
  • Figures: 25
  • Series: Electronics 

 

The global landscape of semiconductor manufacturing is rapidly evolving, with advanced packaging emerging as a critical component of manufacturing and design. It affects power, performance, and cost on a macro level, and the basic functionality of all chips on a micro level. Advanced packaging allows for the creation of faster, cost-effective systems by integrating various chips, a technique that's increasingly essential given the physical limitations of traditional chip miniaturization. It is reshaping the industry, enabling the integration of diverse chip types and enhancing processing speeds.

The U.S. government recognizes the importance of advanced packaging and has introduced a $3 billion National Advanced Packaging Manufacturing Program aimed at establishing high-volume packaging facilities by the end of the decade. The focus on packaging complements the existing efforts under the CHIPS and Science Act, emphasizing the interconnectedness of chipmaking and packaging.

The Global Market for Advanced Semiconductor Packaging 2024-2035 provides a comprehensive analysis of the global advanced semiconductor packaging technologies market from 2020-2035. It encompasses packaging approaches like wafer-level packaging, 2.5D/3D integration, chiplets, fan-out, and flip chip, analyzing market values in the billions (USD) by type, region, and end-use application.

Trends analyzed include heterogeneous integration, interconnects, thermal solutions, miniaturization, supply chain maturity, simulation/data analytics. Leading companies profiled include TSMC, Samsung, Intel, JCET, Amkor. Applications covered include AI, mobile, automotive, aerospace, IoT, communications (5G/6G), high performance computing, medical, and consumer electronics.

Regional markets explored include North America, Asia Pacific, Europe, China, Japan, and RoW. The report also assesses drivers like ML/AI, data centers, EV/ADAS; challenges like costs, complexity, reliability; emerging approaches like system-in-package, monolithic 3D ICs, advanced substrates, novel materials. Overall an in-depth benchmark analysis of the opportunities within the advancing semiconductor packaging industry.

Report contents include: 

  • Market size and forecasts
  • Key technology trends
  • Growth drivers and challenges
  • Competitive landscape analysis
  • Future packaging trends outlook
  • In-depth analysis of wafer level packaging (WLP)
  • System-in-Package (SiP) and heterogeneous integration
  • Monolithic 3D ICs overview
  • Advanced semiconductor packaging applications across key markets: AI, mobile, automotive, aerospace, IoT, communications, HPC, medical, consumer electronics
  • Regional market breakdown
  • Assessment of key industry challenges: complexity, costs, supply chain maturity, standards
  • Company profiles: Strategies and technologies of 90 key players. Companies profiled include 3DSEMI, Amkor, Chipbond, ChipMOS, Intel Corporation, Leader-Tech Semiconductor, Powertech, Samsung Electronics, Silicon Box, SJ Semiconductor Corp.,  SK hynix, SPIL, Tongfu, Taiwan Semiconductor Manufacturing Company (TSMC) and Yuehai Integrated. 

1              RESEARCH METHODOLOGY         14

 

2              EXECUTIVE SUMMARY   15

  • 2.1          Semiconductor Packaging Technology Overview 16
    • 2.1.1      Conventional packaging approaches        19
    • 2.1.2      Advanced packaging approaches               20
  • 2.2          Semiconductor Supply Chain       22
  • 2.3          Key Technology Trends in Advanced Packaging   22
  • 2.4          Market Size and Growth Projections (Billions USD)            24
    • 2.4.1      By packaging type            24
    • 2.4.2      By market           26
    • 2.4.3      By region             28
  • 2.5          Market Growth Drivers  30
  • 2.6          Competitive Landscape 32
  • 2.7          Market Challenges          34
  • 2.8          Recent market news and investments    36
  • 2.9          Future outlook  38
    • 2.9.1      Heterogeneous Integration         39
    • 2.9.2      Chiplets and Die Disaggregation 41
    • 2.9.3      Advanced Interconnects               43
    • 2.9.4      Scaling and Miniaturization          45
    • 2.9.5      Thermal Management   47
    • 2.9.6      Materials Innovation      48
    • 2.9.7      Supply Chain Developments       50
    • 2.9.8      Role of Simulation and Data Analytics      52

 

3              SEMICONDUCTOR PACKAGING TECHNOLOGIES  58

  • 3.1          Transistor Device Scaling               58
    • 3.1.1      Overview            58
  • 3.2          Wafer Level Packaging   61
  • 3.3          Fan-Out Wafer Level Packaging  62
  • 3.4          Chiplets                64
  • 3.5          Interconnection in Semiconductor Packaging       67
    • 3.5.1      Overview            67
    • 3.5.2      Wire bonding     67
    • 3.5.3      Flip-chip bonding             69
    • 3.5.4      Through-silicon via (TSV) bonding             72
    • 3.5.5      Hybrid bonding with chiplets       73
  • 3.6          2.5D and 3D Packaging  75
    • 3.6.1      2.5D packaging  75
      • 3.6.1.1   Overview            76
        • 3.6.1.1.1               2.5D vs. 3D Packaging     76
      • 3.6.1.2   Benefits               77
      • 3.6.1.3   Challenges          79
      • 3.6.1.4   Trends  80
      • 3.6.1.5   Market players  81
      • 3.6.1.6   2.5D Organic-based packaging    83
      • 3.6.1.7   2.5D glass-based packaging         84
    • 3.6.2      3D packaging     88
      • 3.6.2.1   Benefits               89
      • 3.6.2.2   Challenges          92
      • 3.6.2.3   Trends  94
      • 3.6.2.4   Embedded Si bridges      96
      • 3.6.2.5   Si interposer      97
      • 3.6.2.6   3D Hybrid bonding          98
      • 3.6.2.7   Market players  98
  • 3.7          Flip Chip Packaging          102
  • 3.8          Embedded Die Packaging              104
  • 3.9          Trends in Advanced Packaging   106
  • 3.10        Packaging Roadmap        108

 

4              WAFER-LEVEL PACKAGING          111

  • 4.1          Introduction       111
  • 4.2          Benefits               112
  • 4.3          Types of Wafer Level Packaging 113
    • 4.3.1      Wafer Level Chip Scale Packaging              114
      • 4.3.1.1   Overview            114
      • 4.3.1.2   Advantages        114
      • 4.3.1.3   Applications       115
    • 4.3.2      Fan-Out Wafer Level Packaging  117
      • 4.3.2.1   Overview            117
      • 4.3.2.2   Advantages        117
      • 4.3.2.3   Applications       119
    • 4.3.3      Wafer Level Fan-Out Packaging  120
      • 4.3.3.1   Overview            120
      • 4.3.3.2   Benefits               121
      • 4.3.3.3   Applications       122
    • 4.3.4      Other Types of WLP        123
  • 4.4          WLP Manufacturing Processes   124
    • 4.4.1      Wafer Preparation           124
    • 4.4.2      RDL Buildup        125
    • 4.4.3      Bumping              126
    • 4.4.4      Encapsulation    127
    • 4.4.5      Integration         128
    • 4.4.6      Test and Singulation        129
  • 4.5          Wafer Level Packaging Trends    131
  • 4.6          Applications of Wafer Level Packaging    133
    • 4.6.1      Mobile and Consumer Electronics             133
    • 4.6.2      Automotive Electronics 134
    • 4.6.3      IoT and Industrial             135
    • 4.6.4      High Performance Computing    136
    • 4.6.5      Aerospace and Defense 137
  • 4.7          Wafer Level Packaging Outlook  138

 

5              SYSTEM-IN-PACKAGE AND HETEROGENEOUS INTEGRATION         139

  • 5.1          Introduction       139
  • 5.2          Approaches for heterogenous integration             141
  • 5.3          SiP Manufacturing Approaches  142
    • 5.3.1      2.5D Integrated Interposers        143
    • 5.3.2      Multi-Chip Modules        145
    • 5.3.3      3D Stacked packages      146
    • 5.3.4      Fan-Out Wafer Level Packaging  149
    • 5.3.5      Flip Chip Package-on-Package    150
  • 5.4          SiP Component Integration         152
  • 5.5          Heterogeneous Integration Drivers          154
  • 5.6          Trends Driving SiP Adoption        155
  • 5.7          SiP Applications 156
  • 5.8          SiP Industry Landscape  157
  • 5.9          Outlook on Heterogeneous Integration  160

 

6              MONOLITHIC 3D IC          162

  • 6.1          Overview            162
  • 6.2          Benefits               164
  • 6.3          Challenges          165
  • 6.4          Future outlook  166

 

7              MARKETS AND APPLICATIONS    168

  • 7.1          Market value chain          168
  • 7.2          Packaging trends by market         169
  • 7.3          Artificial Intelligence (AI)              170
    • 7.3.1      Applications       171
    • 7.3.2      Packaging            172
  • 7.4          Mobile and Handheld Devices    172
    • 7.4.1      Applications       173
    • 7.4.2      Packaging            173
  • 7.5          High Performance Computing    175
    • 7.5.1      Applications       175
    • 7.5.2      Packaging            176
  • 7.6          Automotive Electronics 179
    • 7.6.1      Applications       179
    • 7.6.2      Packaging            179
  • 7.7          Internet of Things (IoT) Devices 180
    • 7.7.1      Applications       181
    • 7.7.2      Packaging            181
  • 7.8          5G & 6G Communications Infrastructure               182
    • 7.8.1      Applications       182
    • 7.8.2      Packaging            182
  • 7.9          Aerospace and Defense Electronics          185
    • 7.9.1      Applications       185
    • 7.9.2      Packaging            187
  • 7.10        Medical Electronics         188
    • 7.10.1    Applications       188
    • 7.10.2    Packaging            189
  • 7.11        Consumer Electronics     189
    • 7.11.1    Applications       189
    • 7.11.2    Packaging            190
  • 7.12        Global market (Units)     193
    • 7.12.1    By market           193
    • 7.12.2    Regional markets             196
      • 7.12.2.1                Asia Pacific          197
        • 7.12.2.1.1             China     198
        • 7.12.2.1.2             Taiwan  199
        • 7.12.2.1.3             Japan    200
        • 7.12.2.1.4             South Korea       201
      • 7.12.2.2                North America   202
        • 7.12.2.2.1             United States     203
        • 7.12.2.2.2             Canada 204
        • 7.12.2.2.3             Mexico 205
      • 7.12.2.3                Europe 206
        • 7.12.2.3.1             Germany             208
        • 7.12.2.3.2             France  209
        • 7.12.2.3.3             United Kingdom               210
        • 7.12.2.3.4             Nordic Countries              211
      • 7.12.2.4                Rest of World     212

 

8              MARKET PLAYERS             215

  • 8.1          Integrated Device Manufacturers             215
  • 8.2          Outsourced Semiconductor Assembly and Test (OSAT) Companies            217
  • 8.3          Foundries            218
    • 8.3.1      Semiconductor foundries technology roadmaps 218
  • 8.4          Electronics OEMs             220
  • 8.5          Packaging Equipment and Materials Companies 222

 

9              MARKET CHALLENGES    225

  • 9.1          Technical Complexity     225
  • 9.2          Supply Chain Maturity    226
  • 9.3          Cost       227
  • 9.4          Standards            228
  • 9.5          Reliability Assurance      229

 

10           COMPANY PROFILES       230 (90 company profiles)

 

11           REFERENCES       317

 

List of Tables

  • Table 1. Key Technology Trends in Advanced Packaging. 23
  • Table 2. Global advanced semiconductor packaging market 2020-2035 (billions USD), by type.      24
  • Table 3. Global advanced semiconductor packaging market 2020-2035 (billions USD), by market. 26
  • Table 4. Global advanced semiconductor packaging market 2020-2035 (billions USD), by region.  28
  • Table 5. Market Growth Drivers for advanced semiconductor packaging. 30
  • Table 6. Challenges Facing Advanced Packaging Adoption.             34
  • Table 7. Recent advanced semiconductor packaging market news and investments.          36
  • Table 8. Challenges in transistor scaling. 60
  • Table 9. Specifications of interconnection methods.         67
  • Table 10. 2.5D vs. 3D packaging. 76
  • Table 11. 2.5D packaging challenges.       79
  • Table 12. Market players in 2.5D packaging.         81
  • Table 13. Advantages and disadvantages of 3D packaging.             88
  • Table 14. Trends in Advanced Packaging.               106
  • Table 15. Key trends shaping wafer level packaging.         131
  • Table 16. Key factors driving adoption of heterogeneous integration through SiPs and multi-die packages.              154
  • Table 17. Benefits of monolithic 3D ICs.  164
  • Table 18. Challenges of monolithic 3D ICs.             165
  • Table 19. Advanced semiconductor packaging market value chain.             168
  • Table 20. Markets and applications for advanced semiconductor packaging.          170
  • Table 21. Advanced semiconductor packaging (units), 2020-2025, by market.       193
  • Table 22. Advanced semiconductor packaging (units), 2020-2025, by region.         195

 

List of Figures

  • Figure 1. Timeline of different packaging technologies.   19
  • Figure 2. Evolution roadmap for semiconductor packaging.           20
  • Figure 3. Semiconductor Supply Chain.   22
  • Figure 4. Global advanced semiconductor packaging market 2020-2035 (billions USD), by type.    25
  • Figure 5. Global advanced semiconductor packaging market 2020-2035 (billions USD), by market.               26
  • Figure 6. Global advanced semiconductor packaging market 2020-2035 (billions USD), by region. 28
  • Figure 7. Advanced semiconductor packaging (units), 2020-2025, by market.        56
  • Figure 8. Scaling technology roadmap.    59
  • Figure 9. Wafer-level chip scale packaging (WLCSP)           61
  • Figure 10. Embedded wafer-level ball grid array (eWLB). 62
  • Figure 11. Fan-out wafer-level packaging (FOWLP).           63
  • Figure 12. Chiplet design.             64
  • Figure 13. 2D chip packaging.      75
  • Figure 14. 2.5D-integrated packaging on a silicon interposer.       79
  • Figure 15. RDL fabrication.           79
  • Figure 16. Three-die, wire-bond semiconductor assembly.            90
  • Figure 17. 3D integration roadmap.          95
  • Figure 18. Projected timelines for packaging and interconnects.  109
  • Figure 19. Typical WLCSP structure.         114
  • Figure 20. Typical FOWLP structure,         117
  • Figure 21. 2.5D chiplet integration.          143
  • Figure 22. Advanced semiconductor packaging (units), 2020-2025, by market.      194
  • Figure 23. Advanced semiconductor packaging (units), 2020-2025, by region.       196
  • Figure 24. 2.5D Molded Interposer on Substrate (MIoS) package.               291
  • Figure 25. 12-layer HBM3.            297

 

The Global Market for Advanced Semiconductor Packaging 2024-2035
The Global Market for Advanced Semiconductor Packaging 2024-2035
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The Global Market for Advanced Semiconductor Packaging 2024-2035
The Global Market for Advanced Semiconductor Packaging 2024-2035
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